2007-03-28 1 SMBD7000/mmbd7000... silicon switching diode array ? for high-speed switching applications ? pb-free (rohs compliant) package 1) ? qualified according aec q101 SMBD7000/mmbd7000 type package configuration marking SMBD7000/mmbd7000 sot23 series s5c maximum ratings at t a = 25c, unless otherwise specified parameter symbol value unit diode reverse voltage v r 100 v peak reverse voltage v rm 100 forward current i f 200 ma non-repetitive peak surge forward current t = 1 s t = 1 s i fsm 4.5 0.5 a total power dissipation t s 28c p tot 330 mw junction temperature t j 150 c storage temperature t stg -65 ... 150 thermal resistance parameter symbol value unit junction - soldering point 2) SMBD7000/mmbd7000 r thjs 360 k/w 1 pb-containing package may be available upon special request 2 for calculation of r thja please refer to application note thermal resistance
2007-03-28 2 SMBD7000/mmbd7000... electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics breakdown voltage i (br) = 100 a v (br) 100 - - v reverse current v r = 50 v v r = 100 v v r = 50 v, t a = 150 c i r - - - - - - 0.3 0.5 100 a forward voltage i f = 1 ma i f = 10 ma i f = 50 ma i f = 100 ma i f = 150 ma v f 550 670 - 750 - - - - - - 700 820 1000 1100 1250 mv ac characteristics diode capacitance v r = 0 v, f = 1 mhz c t - - 2 pf reverse recovery time i f = 10 ma, i r = 10 ma, measured at i r = 1ma, r l = 100 ? t rr - - 4 ns test circuit for reverse recovery time ehn00019 f d.u.t. oscillograph pulse generator: t p = 100ns, d = 0.05, t r = 0.6ns, r i = 50 ? oscillograph: r = 50 ? , t r = 0.35ns, c 1pf
2007-03-28 3 SMBD7000/mmbd7000... reverse current i r = ? ( t a ) v r = parameter 0 25 50 75 100 c 150 t a 1 10 2 10 3 10 4 10 5 10 na i r 70 v 25 v forward voltage v f = ? ( t a ) i f = parameter 0 0.5 1.0 0 50 100 150 smbd 7000 ehb00139 v t a v f ?c f = 100 ma 10 ma 1 ma 0.1 ma forward current i f = ? ( v f ) t a = 25c 0 0 ehb00137 smbd 7000 0.5 1.0 v 1.5 50 100 ma 150 f f v max typ forward current i f = ? ( t s ) SMBD7000/mmbd7000 0 15 30 45 60 75 90 105 120 c 150 t s 0 25 50 75 100 125 150 175 200 ma 250 i f
2007-03-28 4 SMBD7000/mmbd7000... permissible puls load r thjs = ? ( t p ) 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 r thjs d = 0,5 0,2 0,1 0,05 0,02 0,01 0,005 0 permissible pulse load i fmax / i fdc = ? ( t p ) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 - i fmax / i fdc d = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
2007-03-28 5 SMBD7000/mmbd7000... package sot23 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel eh s bcw66 type code pin 1 0.8 0.9 0.9 1.3 0.8 1.2 0.25 m bc 1.9 -0.05 +0.1 0.4 0.1 2.9 0.95 c b 0...8? 0.2 a 0.1 max. 10? max. 0.08...0.15 1.3 0.1 10? max. m 2.4 0.15 0.1 1 a 0.15 min. 1) 1) lead width can be 0.6 max. in dambar area 12 3 3.15 4 2.65 2.13 0.9 8 0.2 1.15 pin 1 manufacturer 2005, june date code (ym)
2007-03-28 6 SMBD7000/mmbd7000... edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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